Hybrid Robotic Wafer Laminator/Sheeter/Stacker

Specifications

Overview
Throughput	250 wafers per hour
Controller	Touch screen with stand alone controller
Light bar	Tool status (cassette empty, fault, warning, running)
Safety	NEC compliant, UL listed components, Semi S2-S8
Tape
Film	Dry Film Laminate PET + EVA 50um to 250um thick PET + 25 to 50um thick EVA Total Thickness: 75um to 25um Length: 250′ to 1000′ Width: 125mm to 190mm
Construction	PET with PSA backing PSA backing has a release layer that requires an additional winder
Alignment	Pre-punched alignment holes in film
Robot
Specification	Multi-access robot Load from 3×50 or 100 wafer cassettes Cascading cassette loading (operator will load new cassette as needed)
Wafers	108.5 +/-.5mm x 108.5 +/-.5mm R2.5mm max corners .650um thick
Details	Cassette-mapping with crossed wafer detection
Wafer-to-wafer pitch	Variable within a batch: 120mm to 190mm Operator controllable via touch-screen
Laminator
Wafer Carrier	Teflon coated 35-150 deg C
Heated Nip Roller	Speed range 100-1000mm/min (6 to 60 sec lamination time) Heated 35-150 deg C
Process control requirement	Maximum bubble size: 10um Wrinkles: no visible at 40x Tears: no visible at 40x