Custom, turnkey, roll-to-roll automation system with electrical testing and vision inspection.
Hybrid Robotic Wafer Laminator/Sheeter/Stacker
  • robotic-lamination-2
  • robotic-lamination-1

Process

  1. Wafer cassette loading
  2. Robotic wafer pick
  3. Vision registration
  4. Robotic wafer placement
  5. Tape unwind
  6. Heated tape to wafer lamination
  7. Vision inspection
  8. Singulation
  9. Final product stacking

Specifications

Overview
Throughput250 wafers per hour
ControllerTouch screen with stand alone controller
Light barTool status (cassette empty, fault, warning, running)
SafetyNEC compliant, UL listed components, Semi S2-S8
Tape
FilmDry Film Laminate PET + EVA
50um to 250um thick PET + 25 to 50um thick EVA
Total Thickness: 75um to 25um
Length: 250′ to 1000′
Width: 125mm to 190mm
ConstructionPET with PSA backing
PSA backing has a release layer that requires an additional winder
AlignmentPre-punched alignment holes in film
Robot
SpecificationMulti-access robot
Load from 3×50 or 100 wafer cassettes
Cascading cassette loading (operator will load new cassette as needed)
Wafers108.5 +/-.5mm x 108.5 +/-.5mm
R2.5mm max corners
.650um thick
DetailsCassette-mapping with crossed wafer detection
Wafer-to-wafer pitchVariable within a batch: 120mm to 190mm
Operator controllable via touch-screen
Laminator
Wafer CarrierTeflon coated
35-150 deg C
Heated Nip RollerSpeed range 100-1000mm/min (6 to 60 sec lamination time)
Heated 35-150 deg C
Process control requirementMaximum bubble size: 10um
Wrinkles: no visible at 40x
Tears: no visible at 40x

 

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Northfield Automation Systems
1325 Armstrong Road
Northfield, MN 55057